June 25-26 2026
The Diaspora Innovation & AI Conference (DIAC) 2026
The Diaspora Innovation & AI Conference (DIAC) 2026, organized by the Kenya–USA
Tech Forum (KUSAT), is a two-day international conference scheduled for June 2026 in
Washington, D.C., bringing together approximately 200 participants from across the global
diaspora.
Panel Discussion 1 - Innovation in the Diaspora: Success Stories
Q&A Sessions
Leveraging Technology for Social Impact
Exhibition and Networking Sessions
DIAC 2026 convenes diaspora scholars, students, policymakers, industry leaders, and
innovators from Kenya and the United States to advance dialogue and collaboration in
STEM, AI, innovation, entrepreneurship and global development.
Attendees and participants benefit from expert-led discussions, networking opportunities,
exposure to cutting-edge innovations, and platforms to present research and showcase
impactful initiatives.
Please find below the available sponsorship packages and associated benefits.
Conference Tickets (USD)
• Listener / Attendee: $200
• Speaker / Presenter: $300
Sponsorship Packages (USD)
• Double Platinum Sponsor: $15,000
• Platinum Sponsor: $10,000
• Diamond Sponsor: $7,500
• Gold Sponsor: $5,000
• Silver Sponsor: $2,500
• Bronze Sponsor: $1,500
• VIP Attendee Package: $1,000
We look forward to your valued engagement in making DIAC 2026 a resounding success.
For any additional info, use the contacts provided below.
Phone - +254 725 271 033 | +1425 766 4431
Email - info@kusat.tech